thermoelectrics: was that Intel as the assignee?
March 26, 2009
We last posted an article about thermoelectrics in January 2008. Since then thermoelectrics have continued to be an area of great interest, as the technologies develop and their utility is further demonstrated. A case in point is this recent abstract from Nature that discusses advances in superlattice-based structures. It was of interest to note co-authors from Intel are listed. This is no surprise as the semiconductor industry has always been considered a prime market for superlattice based thermoelectric structures because of the industries great experience in the deposition techniques and equipment that is applicable to superlattice device fabrication.
A look at the author list of the above abstract reminded us of United States patent 7,279,796 (the ‘796 patent) to Hu, Chrysler and Mahajan, and assigned to Intel. The ‘796 patent details a basic structure that integrates a thermoelectric device and integrated circuit. Intel is defining its space within the thermoelectric landscape.
With reference to the above representative figure from the ‘796 patent the integrated circuit 14 is located on one side of silicon wafer 12, while the thermoelectric module 56 is located on the other side. Metal vias 46 and 48 then connect module 56 to the power and ground planes, within the metallization 16, respectively.
The involvement of Intel in thermoelectrics suggests the technology will be further advanced towards commercialization now that such a large, experienced semiconductor company is lending support. Thermoelectrics have always presented a compelling story and promise. Integration of thermoelectric structures within integrated circuits could provide competitive advantages in either reducing the power consumed in mobile devices or reducing the energy expended cooling large installations. This goes hand-in-hand with the growing efforts to “green’ data centers and other IT infrastructure.